UF Packaging Engineering goes to PACK EXPO
By Kimberly Hafner, ABE Graduate Student specializing in Packaging Engineering
“PACK EXPO was a unique experience to see all that the packaging world has to offer. It was truly mind-blowing to see Packaging in ways I had never even considered before,” said Dylan Green, UF Biological Engineering student with a concentration in Packaging Engineering.
University of Florida students attended the 2019 PACK EXPO in Las Vegas, Nevada, for a unique opportunity to network with industry professionals and other students studying Packaging Engineering and Packaging Sciences. The UF Packaging Engineering program also had the opportunity to connect with industry stakeholders from across the country.
PACK EXPO is the world’s largest packaging trade show. This annual event attracts 50,000+ professionals from leading consumer packaged goods companies (CPGs) and retailers. This event features 2,500+ exhibitors showcases new packaging materials, equipment, and technologies from a wide range of industries.
This is an invaluable experience that connects students with employment opportunities, practical applications of packaging, and hundreds of other resources. Student activities include tabling at the University of Florida expo booth, walking the trade show floor, conversing with attendees from companies, and participating in the PACK EXPO Amazing Packaging Race, a competition in which students are tasked with visiting participating exhibitors to complete 10-15-minute pass/fail tasks.